BoosterPack:IV-18 VFD Clock
Description goes here.
ID | The IV-18 VFD Clock BoosterPack |
---|---|
Forum | 43oh Forum Thread |
Versions | v1.0, v1.1 |
Buy | @The 43oh Store |
Contents
Features
- Fits the MSP430 Launchpad.
- Awesome retro look
Board Revision History
Revision | Changes |
---|---|
v1.0 | Initial Prototype |
v1.1 | Corrected DS18B20 Package |
Downloads
Hardware | Software |
---|---|
v1.0 | Git Repository |
v1.1 | Git Repository |
Connecting the VFD Clock BoosterPack
Step 1 - Solder the Crystal
Your Launchpad should have shipped with a 13.768kHz crystal. To provide more accurate accurate time-keeping clock, you'll need to solder it to your Launchpad. Instructions for soldering your crystal can be found here
Alternately - you may uncomment the define for NOXTAL in main.c, but time kept by the device will be less accurate.
Once you've soldered your crystal - you may find it helpful to test it using this code - File:Msp430g2xx3 LFxtal nmi.zip. This is a code sample provided by Texas Instruments as part of the code samples for the MSP430G2553. If your crystal is soldered correctly, the red LED on your Launchpad should pulse every second. Otherwise - the red LED will toggle quickly, indicating a fault.
Step 2 - Solder the Surface Mount Chips
There are two SMD chips on this booster pack. You'll want to solder these first - it's easier without the other components on the board. The 8-pin voltage boost IC, and the 28 pin VFD controller chip. Both use an SOIC package, so they're still very easy to hand-solder. Even if you've never soldered SMD components before - it's still very easy.
Both chips have an alignment mark - a line and/or indent to indicate the top of the chip. The silk screen on the circuit board contains an indicator to help you align the chips correctly.
I find that the easiest way to solder an SMD device is to place the chip on the board and then solder a single pin. Once you've done that, reheat the solder to make sure that your pins are positioned correctly on your pads. Once you let that cool - solder the remaining pads without having to worry about the chip moving.