Difference between revisions of "BoosterPack:IV-18 VFD Clock"
(→Step 2 - Solder the Surface Mount Chips) |
(→Step 3) |
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[[File:IV18_BoardsV1_SMDSolder.png]] | [[File:IV18_BoardsV1_SMDSolder.png]] | ||
− | === Step 3 === | + | === Step 3 - Main board components === |
+ | The remaining components can be soldered to the main board in any order. You may find it easier to solder the shorter components first and/or focus on components towards the center of the board. | ||
+ | Please note - there are a few components that are polarity-specific. | ||
+ | Schottky Diode - Make sure that the silver band on this component lines up with the line on the silk screen | ||
+ | Capacitors - Make sure to pay attention to the positive/negative markers on your capacitors and silk screen. Make sure to | ||
+ | |||
+ | If you received your components as part of a kit - you may find [http://www.csgnetwork.com/resistcolcalc.html this page] helpful to locate resistor values. All resistor values are clearly marked on the silk screen. | ||
+ | |||
+ | Inductor | ||
+ | If you have a V1.0 or V1.1 revision of the board - you will need to bend the leads of the inductor | ||
=== Step 4 === | === Step 4 === |
Revision as of 17:56, 20 February 2013
Description goes here.
ID | The IV-18 VFD Clock BoosterPack |
---|---|
Forum | 43oh Forum Thread |
Versions | v1.0, v1.1 |
Buy | @The 43oh Store |
Contents
Features
- Fits the MSP430 Launchpad.
- Awesome retro look
Board Revision History
Revision | Changes |
---|---|
v1.0 | Initial Prototype |
v1.1 | Corrected DS18B20 Package |
Downloads
Hardware | Software |
---|---|
v1.0 | Git Repository |
v1.1 | Git Repository |
Connecting the VFD Clock BoosterPack
Step 1 - Solder the Crystal
Your Launchpad should have shipped with a 13.768kHz crystal. To provide more accurate accurate time-keeping clock, you'll need to solder it to your Launchpad. Instructions for soldering your crystal can be found here
Alternately - you may uncomment the define for NOXTAL in main.c, but time kept by the device will be less accurate.
Once you've soldered your crystal - you may find it helpful to test it using this code - File:Msp430g2xx3 LFxtal nmi.zip. This is a code sample provided by Texas Instruments as part of the code samples for the MSP430G2553. If your crystal is soldered correctly, the red LED on your Launchpad should pulse every second. Otherwise - the red LED will toggle quickly, indicating a fault.
Step 2 - Solder the Surface Mount Chips
There are two SMD chips on this booster pack. You'll want to solder these first - it's easier without the other components on the board. The 8-pin voltage boost IC, and the 28 pin VFD controller chip. Both use an SOIC package, so they're still very easy to hand-solder. Even if you've never soldered SMD components before - it's still very easy.
Both chips have an alignment mark - a line and/or indent to indicate the top of the chip. The silk screen on the circuit board contains an indicator to help you align the chips correctly.
I find that the easiest way to solder an SMD device is to place the chip on the board and then solder a single pin. Once you've done that, reheat the solder to make sure that your pins are positioned correctly on your pads. Once you let that cool - solder the remaining pads without having to worry about the chip moving.
Step 3 - Main board components
The remaining components can be soldered to the main board in any order. You may find it easier to solder the shorter components first and/or focus on components towards the center of the board.
Please note - there are a few components that are polarity-specific.
Schottky Diode - Make sure that the silver band on this component lines up with the line on the silk screen Capacitors - Make sure to pay attention to the positive/negative markers on your capacitors and silk screen. Make sure to
If you received your components as part of a kit - you may find this page helpful to locate resistor values. All resistor values are clearly marked on the silk screen.
Inductor
If you have a V1.0 or V1.1 revision of the board - you will need to bend the leads of the inductor